Difference between revisions of "Published Papers"

From Hyrel3D
Jump to: navigation, search
(Count)
(DIW/SEP/SSE, 2024)
Line 161: Line 161:
 
== DIW/SEP/SSE, 2024 ==
 
== DIW/SEP/SSE, 2024 ==
  
 +
*[https://onlinelibrary.wiley.com/doi/pdf/10.1002/adfm.202417375 Anisotropic and Heterogeneous Thermal Conductivity in Programmed Liquid Metal Composites Through Direct Ink Writing] by a team from [https://www.vt.edu Virginia Tech] and [https://www.unl.edu University of Nebraska-Lincoln]
 
* [https://www.sciencedirect.com/science/article/abs/pii/S1383586624046847 The Selective Adsorption of Anionic Dyes Over 3D Printing Composite Sorbents of Aerogel and Porous Carbon] by a team from the [https://en.njtech.edu.cn/info/1075/1114.htm School of Chemical Engineering, Nanjing Tech University]
 
* [https://www.sciencedirect.com/science/article/abs/pii/S1383586624046847 The Selective Adsorption of Anionic Dyes Over 3D Printing Composite Sorbents of Aerogel and Porous Carbon] by a team from the [https://en.njtech.edu.cn/info/1075/1114.htm School of Chemical Engineering, Nanjing Tech University]
 
* [https://pubs.acs.org/doi/full/10.1021/acsami.4c17115 3D Printed Carbon Nanotube/Phenolic Composites for Thermal Dissipation and Electromagnetic Interference Shielding] by a team from [https://www.tamu.edu/ Texas A&M University] and [https://www.a-star.edu.sg/simtech Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR)]
 
* [https://pubs.acs.org/doi/full/10.1021/acsami.4c17115 3D Printed Carbon Nanotube/Phenolic Composites for Thermal Dissipation and Electromagnetic Interference Shielding] by a team from [https://www.tamu.edu/ Texas A&M University] and [https://www.a-star.edu.sg/simtech Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR)]

Revision as of 15:58, 18 December 2024

Below is a list of published works citing Hyrel equipment.

Count

588 documents as of 18 December, 2024.

Non-Traditional Manufacturing

Including:

  • Antennas, Sensors, Batteries, Inductors, and Circuits
  • Electro-Spinning
  • Electro-Melt-Spinning
  • Melt Electro-Writing (MEW)
  • Multiphase Direct Ink Writing (MDIW)
  • 4D Printing
  • Shape Memory Polymers
  • Nanostructures
  • Micro-Encapsulated Phase-Changing Materials (MEPCM)
  • Printing with Embedded Fibers
  • And combining two or more additive manufacturing methods in a single build.

NTM, 2024

NTM, 2023

NTM, 2022

NTM, 2021

NTM, 2020

NTM, 2019

NTM, 2018

NTM, 2017

NTM, 2016

NTM, 2015

Unheated or Chilled Reservoir Printing

Also known as Robocasting or DIW (Direct Ink Writing), SEP (Semisolid Extrusion Printing), SSE (Semisolid Extrusion). 3DCP (3D Concrete Printing), or DCC (Digital Concrete Construction).

DIW/SEP/SSE, 2024

DIW/SEP/SSE, 2023

DIW/SEP/SSE, 2022

DIW/SEP/SSE, 2021

DIW/SEP/SSE, 2020

DIW/SEP/SSE, 2019

DIW/SEP/SSE, 2018

DIW/SEP/SSE, 2017

DIW/SEP/SSE, 2016

DIW/SEP/SSE, 2015

DIW/SEP/SSE, 2014

Heated Reservoir Printing

Also known as DPE (Direct Powder Extrusion) or HME (Hot Melt Extrusion).

DPE, HME 2024

DPE, HME 2023

DPE, HME 2022

DPE, HME 2021

DPE, HME 2020

DPE, HME 2019

DPE, HME 2018

DPE, HME 2017

Filament Printing

Also known as FFF (Fused Filament Fabrication) or FDM (Fused Deposition Modeling).

FDM/FFF, 2024

FDM/FFF, 2023

FDM/FFF, 2022

FDM/FFF, 2021

FDM/FFF, 2020

FDM/FFF, 2019

FDM/FFF, 2018

FDM/FFF, 2017

FDM/FFF, 2016