Difference between revisions of "Published Papers"

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(DIW/SEP, 2014)
(Published in 2015)
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*[http://hyrel3d.net/papers/3D-4D_Printing_and_Stretchable_Conductive_Adhesives.pdf A Novel Approach to Integrating 3D/4D Printing and Stretchable Conductive Adhesive Technologies for High Frequency Packaging Applications] by a team from [http://www.gatech.edu/ Georgia Tech]
 
*[http://hyrel3d.net/papers/3D-4D_Printing_and_Stretchable_Conductive_Adhesives.pdf A Novel Approach to Integrating 3D/4D Printing and Stretchable Conductive Adhesive Technologies for High Frequency Packaging Applications] by a team from [http://www.gatech.edu/ Georgia Tech]
  
==== Published in 2015 ====
+
== NTM, 2015 ==
  
 
* [http://hyrel3d.net/papers/NinjaFlex_Filament_for_Antenna_Applications.pdf Infill Dependent 3D-Printed Material Based on NinjaFlex Filament for Antenna Applications], [http://www.ieee.org/index.html The Institute of Electrical and Electronics Engineers, Incorporated (IEEE)]
 
* [http://hyrel3d.net/papers/NinjaFlex_Filament_for_Antenna_Applications.pdf Infill Dependent 3D-Printed Material Based on NinjaFlex Filament for Antenna Applications], [http://www.ieee.org/index.html The Institute of Electrical and Electronics Engineers, Incorporated (IEEE)]

Revision as of 17:09, 7 December 2023

Below is a list of published works citing Hyrel equipment.

Count

479 documents as of 5 December, 2023.

Non-Traditional Manufacturing

Including Antennas, Sensors, Inductors, and Circuits; Combined Manufacturing Techniques; Electro-Spinning or Electro-Melt-Spinning or Melt Electro-Writing (MEW); 4D Printing and Shape Memory Polymers; Nanostructures; Micro-Encapsulated Phase-Changing Materials (MEPCM); and also printing with Embedded Fibers and combining FDM with DIW or MEW.

Published in 2023

Published in 2022

Published in 2021

Published in 2020

Published in 2019

Published in 2018

Published in 2017

Published in 2016

NTM, 2015

Unheated or Chilled Reservoir Printing (DIW, SEP, SSE)

Also known as Robocasting or DIW (Direct Ink Writing), SEP (Semisolid Extrusion Printing), or SSE (Semisolid Extrusion).

DIW/SEP/SSE, 2023

DIW/SEP/SSE, 2022

DIW/SEP/SSE, 2021

DIW/SEP/SSE, 2020

DIW/SEP/SSE, 2019

DIW/SEP/SSE, 2018

DIW/SEP/SSE, 2017

DIW/SEP/SSE, 2016

DIW/SEP/SSE, 2015

DIW/SEP/SSE, 2014

Heated Reservoir Printing (DPE, HME)

Also known as DPE (Direct Powder Extrusion) or HME (Hot Melt Extrusion).

DPE, HME 2023

DPE, HME 2022

DPE, HME 2021

DPE, HME 2020

DPE, HME 2019

DPE, HME 2018

DPE, HME 2017

Filament Printing (FFF, FDM)

Also known as FFF (Fused Filament Fabrication) or FDM (Fused Deposition Modeling).

HME/HFF, 2023

HME/HFF, 2022

HME/HFF, 2021

HME/HFF, 2020

HME/HFF, 2019

HME/HFF, 2018

HME/HFF, 2017

HME/HFF, 2016