Difference between revisions of "Published Papers"

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== DIW/SEP/SSE, 2023 ==
 
== DIW/SEP/SSE, 2023 ==
  
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* [https://link.springer.com/article/10.1007/s40820-023-01286-0 Engineering Nano/Microscale Chiral Self-Assembly in 3D Printed Constructs] by a team from the University of South Carolina's [https://sc.edu/study/colleges_schools/engineering_and_computing/departments/chemical_engineering/index.php Department of Chemical Engineering] and [https://sc.edu/study/colleges_schools/engineering_and_computing/departments/biomedical_engineering/index.php  Biomedical Engineering Program] and from [https://www.tainstruments.com/ TA Instruments]
 
* [https://www.sciencedirect.com/science/article/abs/pii/S2214860423005481 Design and Fabrication of Flexible Woodpile Structured Nanocomposite for Microwave Absorption Using Material Extrusion Additive Technique] by a team from the [https://mechanical.iitism.ac.in/ Department of Mechanical Engineering, Indian Institute of Technology (Indian School of Mines), Dhanbad]
 
* [https://www.sciencedirect.com/science/article/abs/pii/S2214860423005481 Design and Fabrication of Flexible Woodpile Structured Nanocomposite for Microwave Absorption Using Material Extrusion Additive Technique] by a team from the [https://mechanical.iitism.ac.in/ Department of Mechanical Engineering, Indian Institute of Technology (Indian School of Mines), Dhanbad]
 
* [https://www.sciencedirect.com/science/article/pii/S2352940723002834 Towards a Predictive Understanding of Direct Ink Writing of Graphene-based Inks] by a team from several departments of [https://www.tue.nl/en/ Eindhoven University of Technology]
 
* [https://www.sciencedirect.com/science/article/pii/S2352940723002834 Towards a Predictive Understanding of Direct Ink Writing of Graphene-based Inks] by a team from several departments of [https://www.tue.nl/en/ Eindhoven University of Technology]

Revision as of 19:16, 5 January 2024

Below is a list of published works citing Hyrel equipment.

Count

492 documents as of 31 December, 2023.

Non-Traditional Manufacturing (NTM)

Including:

  • Antennas
  • Sensors
  • Inductors
  • Circuits
  • Electro-Spinning
  • Electro-Melt-Spinning
  • Melt Electro-Writing (MEW)
  • 4D Printing
  • Shape Memory Polymers
  • Nanostructures
  • Micro-Encapsulated Phase-Changing Materials (MEPCM)
  • Printing with Embedded Fibers
  • And combining two or more additive manufacturing methods in a single build.

NTM, 2023

NTM, 2022

NTM, 2021

NTM, 2020

NTM, 2019

NTM, 2018

NTM, 2017

NTM, 2016

NTM, 2015

Unheated or Chilled Reservoir Printing (DIW, SEP, SSE, 3DCP, DCC)

Also known as Robocasting or DIW (Direct Ink Writing), SEP (Semisolid Extrusion Printing), SSE (Semisolid Extrusion). 3DCP' (3D Concrete Printing), or DCC (Digital Concrete Construction).

DIW/SEP/SSE, 2023

DIW/SEP/SSE, 2022

DIW/SEP/SSE, 2021

DIW/SEP/SSE, 2020

DIW/SEP/SSE, 2019

DIW/SEP/SSE, 2018

DIW/SEP/SSE, 2017

DIW/SEP/SSE, 2016

DIW/SEP/SSE, 2015

DIW/SEP/SSE, 2014

Heated Reservoir Printing (DPE, HME)

Also known as DPE (Direct Powder Extrusion) or HME (Hot Melt Extrusion).

DPE, HME 2023

DPE, HME 2022

DPE, HME 2021

DPE, HME 2020

DPE, HME 2019

DPE, HME 2018

DPE, HME 2017

Filament Printing (FFF, FDM)

Also known as FFF (Fused Filament Fabrication) or FDM (Fused Deposition Modeling).

FDM/HFF, 2023

FDM/HFF, 2022

FDM/HFF, 2021

FDM/HFF, 2020

FDM/HFF, 2019

FDM/HFF, 2018

FDM/HFF, 2017

FDM/HFF, 2016